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Bach 1.0 – Underfill Removal Blade

4,67  TTC

MACH BLADE SERIES – MA1.0 UNDERFILL REMOVAL BLADE This blade helps you removing underfill from the logic board around IC Chips to help the microsoldering process. 2mm blade easily copes with a variety of small size ic. 1. Heated by…

SKU : 107082129914
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MACH BLADE SERIES - MA1.0 UNDERFILL REMOVAL BLADE This blade helps you removing underfill from the logic board around IC Chips to help the microsoldering process. 2mm blade easily copes with a variety of small size ic. 1. Heated by hot air gun, 2. Cut the side edge of the blade and take it out.
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